XH LH612

LH Series WLP+ASIC 640×512/12μm VOx Uncooled Thermal Module

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LH612 is one of the LIGHT series infrared thermal camera cores developed by XINGHE. It adopts state-of-the-art 12μm VOx microbolometer technology and integrates 640×512 wafer level package (WLP) infrared thermal detector, high performance signal processing circuit and image processing algorithm.

The LH612 infrared camera module features in precise visualization, sharp and crisp image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.

LH612 thermal imaging module has light weight, compact size, low power consumption and provides multiple interface options. It supports DVP/LVDS multi-mode image output interfaces, RAW/YUV image data output and serial port control. Thanks to its fully optimized structure, low power consumption and various standard interfaces, LH612 infrared camera module can provide customers with some standard configurations and enables easy integration into numerous infrared products, such as thermal imagers and infrared thermographic cameras.

Its lightweight and flexible features with various industry standard interfaces make it beneficial to OEM customers for secondary development and integration in all kinds of infrared thermal cameras. Also some customized OEM solutions are available to meet the requirements of customers. It is easily integrate into many kinds of devices like unmanned aerial vehicles (UAV), drones, as well as police and firefighting units.

Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for LH series to be integrated into more terminal products and greatly reduces the cost for customers.

Main Features:

Optimal SWaP

Mini size: 25.4mmx25.4mmx14.1mm

Light Weight: as low as 11.5g

Power consumption: as low as 0.8W

Outstanding Image Quality

New generation image processing algorithm: NUC/3DNR/DNS/DRC/EE

Temperature measurement range: -20℃~150℃, 0~550℃ (support expansion & customization)

Fast Integration

USB2.0/DVP/LVDS image output interfaces, RAW/YUV image data output, serial port control

Provide ARM/windows/Linux SDK; achieve full screen temperature measurement

Specifications:

ModelLH612/R
IR Detector Performance
Sensitive MaterialVanadium Oxide
Resolution640×512
Pixel Size12μm
Spectral Range8μm~14μm
Typical NETD≤40mK
Image Processing
Frame Rate25Hz/30Hz
Start-up Time5s
Analog VideoPAL/NTSC
Digital VideoRAW/YUV/BT656
Image AlgorithmNon-uniformity Correction (NUC)
3D Noise Reduction (3DNR)
2D Noise Reduction (DNS)
Dynamic Range Compression (DRC)
Edge Enhancement (EE)
Image DisplayBlack Hot/White Hot/Pseudo Color
PC Software
ICC SoftwareModule Control & Video Display
Electrical Specifications
Standard External Interface50Pin_HRS: DF40C-50DP-0.4V(51), (HRS, Male)
USB Expansion BoardType-C
Communication InterfaceTTL-232/USB2.0
Digital Video InterfaceCMOS8/CMOS16/LVDS/USB2.0
Supply Voltage4~5.5V
Typical Power Consumption0.8W
Temperature Measurement
Operating Temperature Range-10℃~+50℃
Temperature Measurement Range-20℃~150℃, 0℃~550℃ (Support Expansion & Customization)
Temperature Measurement AccuracyGreater of ±3℃ or ±3%
Regional Temperature MeasurementSupport Maximum, Minimum and Average Value of the Output Regional Temperature
SDKWindows/Linux/ARM; Achieve Video Stream Analysis and Conversion from Gray to Temperature
Physical Characteristics
Size (mm)25.4×25.4×14.1 (Without Lens)
Weight11.5g (Without Lens)
Environmental Adaptability
Operating Temperature-40°C~+70°C
Storage Temperature-45°C~+85°C
Humidity5%~95%, non-condensing
Vibration5.35grms, 3 Axis
ShockHalf-sine Wave, 40g/11ms, 3 Axis 6 Direction
CertificateROHS2.0/REACH
Optics
Optional LensFixed Focus Athermal: 4.9mm/9.1mm/13mm/19mm/25mm/35mm/50mm/70mm
Protection LevelIP67 Rating (Front Lens)

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